1. Grinding time and speed of silicon carbide abrasive
In the grinding process of silicon carbide abrasive, the grinding time and grinding speed are closely related to the two grinding elements, and they are all proportional to the stroke of the workpiece during grinding.
The grinding time of silicon carbide abrasive is too long, not only the processing accuracy tends to be stable without improvemnt, but also the accuracy will be lost due to overheating and the grinding efficiency will be reduced.
Practice has shown that in the initial stage of silicon carbide abrasive grinding, the geometrical error of the workpiece is eliminated and the surface finish is improved quickly, and then it gradually slows down.
2. Analysis of the grinding principle of silicon carbide abrasive
In the initial stage of silicon carbide abrasive grinding, due to the original roughness and geometric shape error of the workpiece, the contact area between the workpiece and the grinding tool is small, so that the abrasive grains are pressed down deeper.
As the grinding time of silicon carbide abrasive increases, the reduction of abrasive grains becomes shallower, the number of abrasive grains passing through the cross-sectional surface of the workpiece increases, the geometric shape error becomes smaller quickly, and the surface finish improves faster. When the geometrical error is basically eliminated, the workpiece and the abrasive grains on the grinding tool are in contact with each other more. At this time, the reduction depth of the abrasive grains is shallow, and the cutting thickness at each point tends to be uniform.
If the grinding time of silicon carbide abrasive is longer, the number of abrasive grains through the cross section of the workpiece will increase, and the improvement of the accuracy of the workpiece will become slow. After a certain grinding time, the passivation of the abrasive grains is finer, the reduction is shallower, the cutting ability is also lower, and gradually tends to be stable.
For rough grinding, in order to obtain higher grinding efficiency, the grinding time of silicon carbide abrasives should be determined mainly according to the cutting speed of abrasive grains. For fine grinding, the experimental curve shows that the grinding time is in the range of 1 to 3 minutes, and the change of the grinding effect has slowed down. If more than 3 minutes, there is no significant change in the improvement of the grinding effect.
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